Process Integration Development Engineer, Defect Metrology

<h1>Process Integration Development Engineer - TD Defect Metrology</h1><p><strong>Location:</strong> US, Oregon, Hillsboro</p><p><strong>Time Type:</strong> Full time</p><h3>Job Description</h3><h1><b>Job Details:</b></h1><p></p><p></p><h2>Job Description: </h2><p>Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers needs with precision.</p><br /><p>Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet.</p><br /><p>Life at Intel: /><p>As a Process Integration Development Engineer, you will play a pivotal role in advancing semiconductor technology by designing, executing, and analyzing experiments to enhance process performance. Using cutting-edge materials and equipment, you will develop integrated solutions to meet quality, reliability, and manufacturability requirements, driving technology transfer to high-volume manufacturing. Your work will directly contribute to optimizing outputs and shaping Intels future innovations. </p><br /><p>Joining Intel Foundrys Logic Technology Development (LTD), you will be part of a team focused on driving advancements in silicon process technology. LTD is at the forefront of sustaining Moores Law by enabling world-class semiconductor manufacturing. The group collaborates across engineering disciplines to develop processes that meet Intels high standards for yield, performance, and reliability, ensuring the delivery of groundbreaking technology to our customers. </p><br /><p><b>Your responsibilities may include but not limited to:</b></p><br /><ul><li>Plan and execute experiments to fully characterize processes throughout the development cycle and improve product performance. </li><li>Develop and qualify materials and equipment to meet reliability, cost, and manufacturability requirements. </li><li>Conduct feasibility studies and identify process solutions in collaboration with product and module engineering teams. </li><li>Leverage big data analysis to identify and resolve process design weaknesses or manufacturing tool issues. </li><li>Lead new product qualifications and ensure seamless technology transfers to high-volume manufacturing using the Copy Exactly methodology. </li><li>Collaborate with development teams and material suppliers to align processes with technology roadmaps. </li><li>Organize and present process solutions to engineering teams to address customer requests or resolve issues.</li></ul><p></p><p></p><h2><b>Qualifications:</b></h2><p>Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. The experience listed below may be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.</p><br /><p><b>Minimum Qualifications</b>:</p><br /><ul><li>Ph.D. in Computer Science, Physics, Materials Science and Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, Optics, Chemistry, or a related field; OR a Masters degree in the aforementioned fields with 4+ years of engineering industry experience. </li><li>Experience in materials characterization techniques such as SEM, TEM, Spectroscopy or other metrology tools. </li><li>Experience with semiconductor processing fundamentals, including lithography, etching, polishing, chemical/physical reactions, or device physics. </li><li>Experience in statistical or data analysis tools like MATLAB, JMP, or Excel, and familiarity with design of experiments (DOE) principles. </li></ul><br /><p><b>Preferred Qualifications: </b></p><br /><ul><li>Proven experience in defect reduction or process integration within semiconductor manufacturing. </li><li>Knowledge of Statistical Process Control (SPC) methods or advanced process controls (APC). </li><li>Expertise in advanced transistor device structures and architectures, including fabrication processes. </li><li>Proficiency in scripting languages (e.g., Python, Perl) or programming languages (e.g., SQL, C++). </li><li>Strong communication skills and a collaborative mindset to foster trust and partnerships across engineering teams. </li></ul><br /><p>Take advantage of this opportunity to join Intel and shape the future of engineering. Apply today to be part of a team that drives industry-leading innovation and transformation.</p><br /><p>Interview Tips: /><p></p><p> </p><p></p><p></p><h2>Job Type:</h2>Experienced Hire<p></p><p></p><h2>Shift:</h2>Shift 1 (United States of America)<p></p><p></p><h2>Primary Location: </h2>US, Oregon, Hillsboro<p></p><p></p><h2>Additional Locations:</h2><p></p><p></p><p></p><p></p><h2>Posting Statement:</h2>All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.<h2></h2><h2>Position of Trust</h2>N/A<p></p><h2>Benefits</h2><p></p><p>We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the <a><span><u>benefits of working at Intel</u></span></a>. </p><p> </p><p> </p>Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD<p> </p><p> </p>The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.<p> </p><p> </p><p></p><p><b>Work Model for this Role</b></p>This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.<p></p><p>*</p><p></p>ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.